Electronic device performance is enhanced through precision bonding, insulation, EMI shielding, and thermal management solutions enabled by advanced adhesive tape technologies.
We provide high-performance die-cut tape solutions tailored for the electronics industry, supporting applications such as insulation, shielding, bonding, and thermal management. Typical applications include:
Screen Fixation & Display Bonding
Application: Screen fixation for mobile phones, tablets, watches, and other devices.
Tape type: Ultra-thin double-sided tape, VHB tape.
Features: High adhesion, transparency, and anti-yellowing properties.
Dustproof and Waterproof Sealing
Application: Sealing of camera modules, receivers, Type-C interfaces, microphone openings, and other parts.
Tape type: Foam adhesive and packaging adhesive.
Features: Waterproof rating up to IP67 and high die-cutting precision.
EMI Shielding & Anti-Interference
Application: Anti-interference for motherboards, antenna peripheries, and connectors.
Tape type: Conductive cloth tape, aluminum foil tape, copper foil tape.
Features: Good conductivity and shielding effect.
Thermal Management
Application: Chips, power devices, and wireless charging areas.
Tape type: Thermally conductive tape, thermally conductive silicone sheets.
Features: Improve heat dissipation efficiency and extend electronic lifespan.
Shock Absorption & Component Fixation
Application: Shock absorption and fixation between components such as batteries, sound chambers, and camera modules.
Tape type: Foam adhesive, EVA gaskets.
Features: Absorbs vibration, improves durability, and enhances user experience.
Label and Insulation Protection
Application: Battery pack, motherboard, cable fixation, and identification.
Tape type: PET tape, PI tape, and label tape.
Features: Good insulation, printable, and high temperature resistance.
Let us help you find tape solutions
Discover precision adhesive tape and die-cut solutions tailored for the electronics industry. These solutions support applications ranging from bonding and insulation to EMI shielding and thermal management.
Common Electronics Tape Materials
Widely used materials for electronics die-cutting and assembly:
Ultra-thin Double-Sided Tape
Touch screen, display, fingerprint module, camera bonding.
Foam Tape
Camera module shock absorption, earpiece dust-proof sealing, speaker fixation.
Conductive Tape
Electromagnetic shielding (EMI), grounding, anti-interference.
Thermal Conductive Tape
Thermal management of chips, batteries, and power devices.
Polyimide Tape
FPC protection, battery pack insulation, electric heating sheet protection.
Polyester Tape
Structural component protection, bundling, and temporary fixed protection.
Recommended Electronics Tape Products
Commonly used electronics tape products from our range:
Nano Carbon Copper Foil Tape for EMI Shielding
Nano carbon copper foil tape with dual thermal and electrical conductivity for EMI shielding, grounding, and heat control in compact electronics.
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Acrylic Kapton Tape (Polyimide Tape)
Polyimide tape with acrylic adhesive for FPC protection, battery pack insulation, and high-temperature masking.
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Ultra-Thin Thermal Conductive Adhesive Tape
Ultra-thin thermally conductive adhesive tape for chip, power device, and wireless charging thermal management.
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Double-Sided VHB Tape for Permanent Bonding
VHB acrylic foam tape for structural bonding and fixation of display modules, housings, and structural components.
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Tell us about your bonding, insulation, thermal, or sealing requirement. Our engineering team will recommend the right tape and die-cut solution for your product.