2.0 ~ 10.0W/m.K Non-Silicone Thermal Interface Pad
2.0 ~ 10.0W/m.K Non-silicone Thermal Pad is a high-performance thermal interface material designed for applications where silicone contamination must be strictly avoided. It provides reliable heat transfer between heat-generating components and heat sinks while meeting stringent cleanliness and comp
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Products Description
2.0 ~ 10.0W/m.K Non-silicone Thermal Pad is a high-performance thermal interface material designed for applications where silicone contamination must be strictly avoided.
Products Construction
See the specification table below for the layered build-up of this tape.
Products Application
This tape is used in heat-management assemblies, where it sits between heat-generating parts and cooling surfaces. Send us the components, working temperatures and required size so our team can confirm the right model for your application.
FAQ
Can this tape be supplied die-cut or in custom widths?
Our die-cutting service covers custom shapes and widths. Send your drawing or the required width and length, and we will confirm availability for this model.
How do I request a sample or quotation?
Send the model, required size, color, quantity and your application to [email protected], or use the inquiry form on this page.
Request a Quote
To help us prepare a quotation, please include the model, required width and length, color, quantity and your application. You can also e-mail [email protected].
